cmf02 2008-05-13 1 toshiba fast recovery diode silicon diffused type cmf02 switching mode power supply applications dc/dc converter applications ? repetitive peak reverse voltage: v rrm = 600 v ? average forward current: i f (av) = 1.0 a ? forward voltage: v fm = 2.0 v (max) ? very fast reverse-recovery time: t rr = 100 ns (max) ? suitable for high-density board a ssembly due to the use of a small surface-mount package, m ? flat tm absolute maximum ratings (ta = 25c) characteristic symbol rating unit repetitive peak reverse voltage v rrm 600 v average forward current i f(av) 1.0 (note 1) a peak one-cycle surge forward current (non-repetitive) i fsm 10 (50 hz) a junction temperature t j ? 40 to 150 c storage temperature range t stg ? 40 to 150 c note 1: t ? = 108c rectangular waveform ( = 180) note 2: using continuously under h eavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. please design the appropriate reliability upon reviewing the toshiba semiconductor reliability handbook (?handling precautions?/?derating concept and methods?) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). unit: mm anode cathode 0.16 0.65 0.2 0.65 0.2 4.7 0.2 3.8 0.1 0 ~ 0.1 0.98 0.1 1.75 0.1 + 0.2 ? 0.1 2.4 jedec ? jeita ? toshiba 3-4e1a weight: 0.023 g (typ.)
cmf02 2008-05-13 2 electrical characteristics (ta = 25c) characteristic symbol test condition min typ. max unit peak forward voltage v fm i fm = 1.0 a (pulse test) ? ? 2.0 v repetitive peak reverse current i rrm v rrm = 600 v (pulse test) ? ? 50 a reverse recovery time t rr i f = 1 a, di/dt =-30 a/ s ? ? 100 ns forward recovery time t fr i f = 1 a ? 270 ? ns device mounted on a ceramic board (board size: 50 mm 50 mm) (soldering land: 2 mm 2 mm) (board thickness: 0.64 mm) ? ? 60 device mounted on a glass-epoxy board (board size: 50 mm 50 mm) (soldering land: 6 mm 6 mm) (board thickness: 1.6 mm) ? ? 135 thermal resistance r th(j-a) device mounted on a glass-epoxy board (board size: 50 mm 50 mm) (soldering land: 2.1 mm 1.4 mm) (board thickness: 1.6 mm) ? ? 210 c/w thermal resistance (junction to lead) r th(j- ? ) ? ? ? 16 c/w marking standard soldering pad abbreviation code part no. f2 cmf02 handling precautions the absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded, even for a moment. do not exceed any of these ratings. the following are the general derating methods we recommend for designing a circuit using this device. v rrm : we recommend that the worst case voltage, includi ng surge voltage, be no greater than 80% of the absolute maximum rating of v rrm for a dc circuit and be no great er than 50% of that of v rrm for an ac circuit. v rrm has a temperature coefficient of 0.1%/ . take this temperature coefficient into account designing a device at low temperature. i f(av) : we recommend that the worst-case current be no great er than 80% of the absolute maximum rating of i f(av) . carry out adequate heat design. if you can?t design a circuit with excellent heat radiation, set the margin by using an allowable ta max- i f(av) curve. this rating specifies the non-r epetitive peak current in one cy cle of a 50-hz sine wave, condition angle 180. therefore, this is only applied for an abnormal operation, whic h seldom occurs during t he lifespan of the device. we recommend that a device be used at tj below 120 under the worst load and heat radiation conditions. thermal resistance between junction and ambient fluctuates depending on the device?s mount ing condition. when using a device, design a circuit board and a soldering land size to match the appropriate thermal resistance value. refer to the rectifier databook for further information. 3.0 1.4 2.1 unit: mm 1.4
cmf02 2008-05-13 3 0 4 12 10 8 1 100 10 3 5 30 50 6 2 0 0 40 160 0.4 0.6 1.2 20 60 120 100 0.2 0.8 80 140 = 60 120 180 1.0 160 0 0 40 0.4 1.2 20 60 120 100 0.2 0.6 80 140 = 60 120 180 0.8 1.0 0 1.0 2.0 0 0.2 0.8 1.2 0.6 = 60 120 180 3.0 0.4 1.0 0 1.0 0.01 0.1 1 10 2.0 3.0 4.0 5.0 25c 75c t j = 150c average forward current i f (av) (a) ta m a x ? i f (av) device mounted on a glass-epoxy board ( board size: 50 mm 50 mm, land size: 6 mm 6 mm ) maximum allowable ambient temperature ta m a x ( c ) average forward current i f (av) (a) p f (av) ? i f (av) average forward power dissipation p f (av) (w) instantaneous forward voltage v f (v) i f ? v f instantaneous forward current i f (a) pulse test ta = 25c f = 50 hz peak surge forward current i fsm (a) number of cycles surge forward current (non-repetitive) average forward current i f (av) (a) t ? max ? i f (av) maximum allowable lead temperature t ? max (c) 360 0 rectangular waveform conduction angle rectangular waveform 0 360 conduction angle: rectangular waveform 0 360 conduction angle: 1 100 1000 0.001 1000 1 0.01 0.1 10 100 10 time t (s) r th (j-a) ? t transient thermal impedance r th (j-a) (c/w) device mounted on a glass-epoxy board (board size: 50 mm 50 mm, land size: 2.1 mm 1.4 mm, board thickness: 1.6 mm) device mounted on a ceramic board (board size: 50 mm 50 mm, land size: 2 mm 2 mm, board thickness: 0.64 mm) device mounted on a glass-epoxy board (board size: 50 mm 50 mm, land size: 6 mm 6 mm, board thickness: 1.6 mm)
cmf02 2008-05-13 4 restrictions on product use ? toshiba corporation, and its subsidiaries and affiliates (collect ively ?toshiba?), reserve the right to make changes to the in formation in this document, and related hardware, software a nd systems (collectively ?product?) without notice. ? this document and any information herein may not be reproduc ed without prior written permission from toshiba. even with toshiba?s written permission, reproduc tion is permissible only if reproducti on is without alteration/omission. ? though toshiba works continually to improve product?s quality and reliability, product can malfunction or fail. customers are responsible for complying with safety standards and for prov iding adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a ma lfunction or failure of product could cause loss of human life, b odily injury or damage to property, including data loss or corruption. before creating and producing des igns and using, customers mus t also refer to and comply with (a) the latest versions of all re levant toshiba information, including without limitation, this d ocument, the specifications, the data sheets and applic ation notes for product and the precautions and conditions set forth in the ?tosh iba semiconductor reliability handbook? and (b) t he instructions for the application that product will be used with or for. custome rs are solely responsible for all aspects of t heir own product design or applications, incl uding but not limited to (a) determining th e appropriateness of the use of this product in such design or applications; (b) evaluating and det ermining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications. toshiba assumes no liability for customers? product design or applications. ? product is intended for use in general el ectronics applications (e.g., computers, personal equipment, office equipment, measur ing equipment, industrial robots and home electroni cs appliances) or for specif ic applications as expre ssly stated in this document . product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality a nd/or reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or se rious public impact (?unintended use?). unintended use includes, without limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic s ignaling equipment, equipment used to control combustions or explosions, safety dev ices, elevators and escalato rs, devices related to el ectric power, and equipment used in finance-related fields. do not use product for unintended use unless specifically permitted in thi s document. ? do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy product, whether in whole or in part. ? product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable laws or regulations. ? the information contained herein is pres ented only as guidance for product use. no re sponsibility is assumed by toshiba for an y infringement of patents or any other intellectual property rights of third parties that may result from the use of product. no license to any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise. ? a bsent a written signed agreement, except as provid ed in the relevant terms and conditions of sale for product, and to the maximum extent allowable by law, toshiba (1) assumes no liability whatsoever, including without limitation, indirect, co nsequential, special, or incidental damages or loss, including without limitation, loss of profit s, loss of opportunities, business interruption and loss of data, and (2) disclaims any and all express or implied warranties and conditions related to sale, use of product, or information, including warranties or conditions of merchantability, fitness for a particular purpose, accuracy of information, or noninfringement. ? do not use or otherwise make available product or related so ftware or technology for any military purposes, including without limitation, for the design, development, use, stockpiling or m anufacturing of nuclear, chemical , or biological weapons or missi le technology products (mass destruction w eapons). product and related software and technology may be controlled under the japanese foreign exchange and foreign trade law and the u.s. expor t administration regulations. ex port and re-export of product or related software or technology are strictly prohibited exc ept in compliance with all applicable export laws and regulations. ? please contact your toshiba sales representative for details as to environmental matters such as the rohs compatibility of pro duct. please use product in compliance with all applicable laws and regula tions that regulate the inclusion or use of controlled subs tances, including without limitation, the eu rohs directive. toshiba assumes no liability for damages or losses occurring as a result o f noncompliance with applicable laws and regulations.
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